Flexible Electronics: Innovative Technique Unveiled

Concept of damage-free dry transfer printing using stress engineering. a, b) Schematic illustrations describing the formation of a single (a) and bilayer (b) structured Pt thin films. c) Stress distribution in the bilayer film and further stress enhancement through mechanical bending.
CREDIT Institute for Basic Science

New method for transfer printing of flexible electronics

https://www.eurekalert.org/news-releases/1049316

By the INSTITUTE FOR BASIC SCIENCE

Researchers at the Institute for Basic Science in South Korea have created a groundbreaking dry transfer printing method for flexible electronics. This new technique, developed by Prof. KIM Dae-Hyeong and his team, avoids the use of toxic chemicals and minimizes damage to electronic materials. By controlling stress within thin films, the method allows for the transfer of high-quality electronic materials to flexible substrates without damage. This advancement holds significant promise for the production of high-performance flexible and stretchable electronic devices.

dry transfer, flexible electronics, high-quality materials, IBS, transfer printing

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